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kicad6copperfill [2022/04/15 16:40] gongyu |
kicad6copperfill [2022/05/29 17:13] (当前版本) gongyu |
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| ## 第25节：敷铜的作用和操作 | ## 第25节：敷铜的作用和操作 | ||
| + | ### 1. 为什么要敷铜? | ||
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| + | 铜填充是PCB上铜被完好无损的地方，而不是被蚀刻出来。我们看到Arduino Uno克隆的背面有一个铜填充区域的例子。 | ||
| + | 铜填充(也被称为“铜倒”)通常用于创建一个接地面(以及5v或3.3V的平面)，作为一个更好的方式来分配地面水平周围的板(相对于使用布线)。敷铜的另一个原因是为了减少从原始板上去除铜所需的蚀刻化学物质的数量，并改善最终PCB的电气和无线电干扰特性。 | ||
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| + | 敷铜有不同的类型。大多数设计师倾向于选择固体铜浇注，也可以创建包含格子图案的铜填充，。 | ||
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| + | ### 如何覆铜? | ||
| In Part 3, you learned about copper fills, which is the fifth step of the PCB layout process. In this recipe, you will learn how to create a copper fill in KiCad. We’ll be using the breadboard power supply board project for this demonstration. Before you create a copper fill, you must complete the routing of your board. In Figure 25.1, you can see the example board fully routed. The next step is to create a copper fill for the ground level (also known as 'ground plane'). | In Part 3, you learned about copper fills, which is the fifth step of the PCB layout process. In this recipe, you will learn how to create a copper fill in KiCad. We’ll be using the breadboard power supply board project for this demonstration. Before you create a copper fill, you must complete the routing of your board. In Figure 25.1, you can see the example board fully routed. The next step is to create a copper fill for the ground level (also known as 'ground plane'). | ||